SERVICES & PRICING

Services & Pricing

Turning front-line experience into deliverables. All services are based on open-domain knowledge and methodology — no confidential information from any former employer is involved. Compliant, after-hours, personal-brand oriented.

Pricing

Four product lines · priced by value

1-on-1 services use scarcity-based pricing; recorded courses use a low-margin, high-volume model. Ranges are for reference — specifics are negotiable.

01 / Résumé

Semiconductor Résumé Restructure

¥299 from · deep version ¥599

1-on-1 résumé rewrite + feedback report, tailored to process / device / PIE / YE roles.

  • Structural restructure so highlights show in 10 seconds
  • Quantified expression — turn skills into numbers
  • Device-role targeting, matched to your target JD
  • Includes CN & EN versions · up to 3 revision rounds
Payment: WeChat / Alipay transfer
Inquire / Book →
02 / Mock Interview

Device / PIE Technical Coaching

¥399 / session · 45 min

Technical interview role-play based on a real JD + a debrief report.

  • Thin-film process / device physics / failure analysis
  • Project deep-dive and tough-question handling
  • Interview-performance debrief and improvement tips
  • Add-on: multi-session bundle discount
Payment: WeChat / Alipay transfer
Inquire / Book →
03 / Consulting

Process Window / Device Review

¥3000–8000 / day · or per project

Part-time advisory for equipment vendors, material suppliers and startups.

  • CVD thin-film process-window development
  • Device structure & reliability review
  • Process-device correlation diagnostics
  • After-hours & compliant, no competing-side side-work
Payment: personal / corporate both OK (as needed)
Inquire / Book →
04 / Training

Thin-Film Process Course (Recorded)

¥199–999 · recorded

Hands-on semiconductor thin-film process course for new grads and career-switchers.

  • Recorded once, learn anytime
  • Hosted on Knowledge Planet / XiaoeTech
  • Community Q&A + resource pack
  • Near-zero marginal cost, low-margin volume
Payment: platform auto-settlement
Course updates →
DIGITAL PRODUCT

Digital Product · Buy once, keep forever

Front-line process expertise compiled into a downloadable paid reference — instant delivery after payment.

PDF Pack / 01

High-Tensile-Stress SiN Thin Film for 28nm CMOS Platforms

Systematic coverage of NMOS mobility enhancement via strain engineering: PECVD stress tuning, UV cure physics, dual-stress-layer / SMT integration, hot-carrier reliability trade-offs — plus a 28nm process-window quick-reference table. Based on open literature & production experience. ~13-page PDF.

  • Both CESL and SMT NMOS enhancement routes covered
  • UV cure physical model + cascaded-wavelength strategy
  • Nitrogen-rich film vs. H-content reliability trade-off
  • Ready to use as DOE baseline on your fab line
¥49 / PDF e-book
WeChat Pay QR

WeChat Scan · Pay ¥49

How to receive after payment
  1. Scan WeChat Pay QR code (note "SiN pack")
  2. Message TianXingJian via site or WeChat
  3. Receive cloud-disk download code → get PDF

Cloud link: share.weiyun.com/tbd3Nlld (password required)

Download code: Message "TianXingJian" after payment

Principles & Boundaries (please read)

  • Compliance first: all services are based on open-domain knowledge and personal methodology — no confidential information, job-created inventions or technical know-how from any former employer.
  • After-hours only: 1-on-1 and advisory work is done in spare time, never interfering with my primary job, and never competing-side side-work against my current employer.
  • Transparent deliverables: price, deliverables and revision scope are confirmed up front to avoid later friction.
  • Credentials: 11 years semiconductor front-line R&D · 60+ patents (5 granted) · 3 tier-1 fab stints · PhD in progress — as a reference for capability.